GENERAL PRODUCTS • Chromium Etchants • Cleaning Solutions • E-Beam Process Chemistries • Photoresist Strippers • Positive Photoresist Developers • Pre-Mixed Metal Etchants I. POSITIVE PHOTORESIST DEVELOPERS CC-191S TMAH + surfactant CC-214S TMAH + surfactant CC-238S TMAH + surfactant CC-300 Various Concentrations Various % TMAH CC-300.40 TMAH CC-564 TMAH + surfactant CC-200 Various Concentrations KOH Based CC-850 K2CO3 II. E-BEAM RESIST DEVELOPERS DP-12 MIAK DP-13 MIAK + MPK DP-14 MIAK + MPK DP-50 DEM + DEK DP-60 BLO + Butyl Lactate III. E-BEAM DEVELOPER RINSE RP-10 MIAK + IPA RP-21 MIBK IV. PRE-ETCH SOLUTIONS PEH-1 For use with Perchloric Acid Cr Etchants PEH-3 High purity pre-etch for Perchloric Acid Cr Etchants PEA-1 For use with Acetic Acid Cr Etchants PEN-1 For use with Nitric Acid Cr Etchants V. CHROMIUM ETCHANTS CR-3, 5, 7, 9, 41 & Others Perchloric Acid 10 – 30 A/sec Etch Rate CR-14 & Others Acetic Acid 18 A/sec CR-4 & Others Nitric Acid 22 A/sec CR-100 Selective in presence of Cu 1 – 2 A/sec   Available with surfactant denoted as “S” or “S10”   VI. ALUMINUM ETCHANTS AL-12S & Others Phosphoric + Acetic + Nitric + surfactant VII. BUFFERED OXIDE ETCHANTS Lodyne BOE 6:1, 15:1 Hydrofluoric + Ammonium Fluoride + surfactant & Other blends   VIII. NICKEL ETCHANTS NI-2 Sulfuric + Peroxide NI-3 Nitric + Peroxide LCE-12 HCL IX. COPPER ETCHANTS CU-5 Sulfuric- + Peroxide PA-50 Phosphoric + Acetic + Peroxide CR-4 CAN + Nitric X. SILICON DIOXIDE/POLYSILICON ETCHANTS SI-2 Ammonium Fluoride + Nitrate MME-235 Nitric + Hydrofluoric XI. INDIUM TIN OXIDE ETCHANTS LCE-10 Hydrochloric + Nitric LCE-12 Hydrochloric + Ferric Chloride + Nitric XII. IRON OXIDE ETCHANTS FE12-CC11 & 13 Hydrochloric + Ferrous Chloride XIII. PHOTORESIST STRIPPERS Nano-Strip & 2X Sulfuric + Peroxide All Positive and Negative Resists RS-6 TMAH Based   RS-41 Semi-aqueous Positive Novalac Photoresists RSC-50 Solvent   RS-100 "   RS-111 "   RS-112 " Positive Optical + E-Beam Resists RS-120 "   RS-122 "   NRS-305 " Negative Polyisoprene Photoresists XIV. CLEANING SOLUTIONS CA-31 NH4OH + Surfactant CA-40 NaOH + Surfactant MC-171C (Concentrate) NH4OH + Surfactant MC-100 (Concentrate) Detergent RA-2 Detergent SSC-1 Citric Acid + surfactant Nano-Strip & 2X Sulfuric + Peroxide XV. EMULSION PROCESS CHEMICALS PD-86 & PD-8650 Negative Developer PF-95 Fixer D-8 Reversal Developer CB-15, CB-16 or CB-16C Clearing Bath RB-90 or RB-90C Reversal Bleach

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